Stacking of Two-Dimensional Materials to Large-Area Heterostructures by Wafer Bonding [Elektronisk resurs]

• The integration of 2D materials for photonic applications is not compatible with high-volume manufacturing. We report a generic methodology that uses only readily available semiconductor equipment and experimentally demonstrate the stacking of graphene and molybdenum disulfide (MoS 2 ). 

Ämnesord

Engineering and Technology  (hsv)

Electrical Engineering, Electronic Engineering, Information Engineering  (hsv)

Other Electrical Engineering, Electronic Engineering, Information Engineering  (hsv)

Teknik och teknologier  (hsv)

Elektroteknik och elektronik  (hsv)

Annan elektroteknik och elektronik  (hsv)

Genre

government publication  (marcgt)