Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers [Elektronisk resurs]
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Malm, Gunnar B. (författare)
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2012 MRS Spring Meeting & Exhibit, Symposium L,April 9-13, 2012 San Francisco, California
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Kolahdouz, Mohammadreza (författare)
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Forsberg, Fredrik (författare)
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Roxhed, Niclas (författare)
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Niklaus, Frank (författare)
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KTH Skolan för informations- och kommunikationsteknik (ICT) (utgivare)
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KTH Skolan för elektro- och systemteknik (EES) (utgivare)
- Publicerad: Materials Research Society, 2012
- Engelska.
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Serie: MRS Online Proceedings Library, 1946-4274
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Ingår i: 2012 MRS Spring Meeting - Symposium L – Group IV Photonics for Sensing and Imaging.
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Sammanfattning
Ämnesord
Stäng
- Semiconductor-based thermistors are very attractive sensor materials for uncooled thermal infrared (IR) bolometers. Very large scale heterogeneous integration of MEMS is an emerging technology that allows the integration of epitaxially grown, high-performance IR bolometer thermistor materials with pre-processed CMOS-based integrated circuits for the sensor read-out. Thermistor materials based on alternating silicon (Si) and silicon-germanium (SiGe) epitaxial layers have been demonstrated and their performance is continuously increasing. Compared to a single layer of silicon or SiGe, the temperature coefficient of resistance (TCR) can be strongly enhanced to about 3 %/K, by using thin alternating layers. In this paper we report on the optimization of alternating Si/SiGe layers by advanced physically based simulations, including quantum mechanical corrections. Our simulation framework provides reliable predictions for a wide range of SiGe layer compositions, including concentration gradients. Finally, our SiGe thermistor layers have been evaluated in terms of low-frequency noise performance, in order to optimize the bolometer detectivity.
Ämnesord
- Engineering and Technology (hsv)
- Teknik och teknologier (hsv)
Indexterm och SAB-rubrik
- semiconducting
- sensor
- bonding
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