LONG-TERM STORAGE OF NANOLITRE AND PICOLITRE LIQUID VOLUMES IN POLYMER MICROFLUIDIC DEVICES [Elektronisk resurs]
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Guo, Maoxiang (författare)
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the 19th International Conference on Miniaturized Systems for Chemistry and Life Sciences
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Vastesson, Alexander (författare)
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Carlborg, Carl Fredrik (författare)
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Haraldsson, Tommy (författare)
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van der Wijngaart, Wouter (författare)
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Microfluidics (medarbetare)
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KTH Skolan för elektro- och systemteknik (EES) (utgivare)
- Publicerad: The Chemical and Biological Microsystems Society, 2015
- Engelska.
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Ingår i: the 19th International Conference on Miniaturized Systems for Chemistry and Life Sciences (Micro TAS). ; 1386-1388
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Sammanfattning
Ämnesord
Stäng
- We introduce uncomplicated nanolitre (23 nL) and picolitre (3.5 pL) liquid volume encapsulation in Off-Stoichiometry Thiol-Ene-Epoxy polymer (OSTEmerTM322) wells using spontaneous room- temperature bonding of gold films to thiol and thioether groups present on the surface of the polymer for leak free sealing. First, we show liquid encapsulation within nL, and pL polymer wells by utilizing 100 nm thin Au-film transfer-bonding onto intermediately cured, and micropatterned OSTEmerTM322. This approach yielded 3 magnitude orders smaller liquid volume encapsulation than previously reported. Secondly, we show that encapsulated liquid can be stored for >116 h. Finally, we demonstrate encapsulated liquid release by thermopneumatic bursting. We conclude that OSTEmerTM322 is excellent for metal-film sealant integration in polymer microfluidic devices.
Ämnesord
- Engineering and Technology (hsv)
- Electrical Engineering, Electronic Engineering, Information Engineering (hsv)
- Other Electrical Engineering, Electronic Engineering, Information Engineering (hsv)
- Teknik och teknologier (hsv)
- Elektroteknik och elektronik (hsv)
- Annan elektroteknik och elektronik (hsv)
- Electrical Engineering (kth)
- Elektro- och systemteknik (kth)
Indexterm och SAB-rubrik
- Liquid encapsulation
- bonding
- off-stoichiometry thiol-ene-epoxy
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